According to UDN Money and CNA reports, the second phase of Chiayi Science Park held its groundbreaking ceremony on July 12, 2026. The site spans about 90 hectares and is expected to complete overall development by 2031. TSMC will build 3 more advanced packaging plants there, adding to the 2 already set up in Phase 1.
According to UDN Money and CNA reports, the second phase of Chiayi Science Park held its groundbreaking ceremony on July 12, 2026. The site spans about 90 hectares and is expected to complete overall development by 2031. TSMC will build 3 more advanced packaging plants there, adding to the 2 already set up in Phase 1.
According to CNA and MoneyDJ citing The Wall Street Journal, the Trump administration treats reviving Intel as a semiconductor strategic priority, using government funding and policy to help it compete with TSMC in advanced packaging. The U.S. government converted a USD 9 billion federal grant into roughly 10% equity, becoming Intel's largest single shareholder. Trump and Commerce Secretary Howard Lutnick also asked Apple to use Intel foundries.
According to INSIDE, the new cloud version of Hermes Agent compresses launch into two clicks and roughly 60 seconds, with a headline focus on letting teams deploy agents at scale. INSIDE also cautions that pricing, data handling, and supported models remain undisclosed. Meanwhile, per Business Next, NVIDIA at GTC Taipei declared "practical AI has arrived" and unveiled a full agent infrastructure stack including the 550-billion-parameter Nemotron 3 Ultra.
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