According to a Technews report dated July 15, 2026, Tong Hsing Electronics (同欣電子) currently runs 400 Gbps optical transceiver modules as its mass-production mainstay, with 800 Gbps products positioned as the company's "key growth driver for 2026," while 1.6 Tbps modules remain in research and development (E2).
A separate China Times report published February 26, 2026 corroborates this trajectory with additional detail: the company's mass-production mainstay is 400G, 100G still carries "some demand," and Tong Hsing began shipping 800G products starting at the end of 2025, while 1.6T "remains in the development stage" (E11).
| Generation | Status | Source |
|---|---|---|
| 100G | Still some customer demand | E11 (China Times) |
| 400G | Mass-production mainstay | E2 (Technews), E11 (China Times) |
| 800G | 2026 key growth driver; shipping since late 2025 | E2 (Technews), E11 (China Times) |
| 1.6T | Research and development stage | E2 (Technews), E11 (China Times) |
The two independently dated reports (July 2026 and February 2026) describe the same generational sequence, indicating the 400G-to-800G-to-1.6T roadmap has been consistently reported across sources over roughly five months.
According to Technews, Tong Hsing Electronics has already delivered a 32×32 channel ceramic core interposer product to customers, described as a current-stage "customer實績" (client-verified deployment) rather than a lab prototype (E3).
The same report states that the ceramic core can achieve large-area coverage of 510 x 515 mm² through "unlimited tiling," a scale the report describes as comparable to glass substrate carriers (E4).
Taken together, the 32×32 channel count and the 510 x 515 mm² tiling capability represent two distinct dimensions of the same ceramic core platform — channel density on one hand, and physical area scalability on the other — both sourced from the same July 15, 2026 Technews report.
Per Technews, Tong Hsing's aluminum nitride (AlN) heat-dissipation substrate has achieved a thermal conductivity of 230 W/m⋅K in actual deployments with a U.S. client, a specification the report links to supporting laser diodes operating at 35 to 42 watts of power per unit (E1).
The same report adds that in thermoelectric cooling (TEC) applications, Tong Hsing can control substrate thickness precisely to 150µm, which the report states helps reduce resistance variation (E5).
| Metric | Value | Application context |
|---|---|---|
| Thermal conductivity | 230 W/m⋅K | Supports 35-42W laser diodes |
| Substrate thickness | 150µm | Thermoelectric cooling, reduces resistance variation |
According to Technews, Tong Hsing has accumulated more than 20 years of experience in Direct Plated Copper (DPC) technology, dating back to 2004 (E6).
China Times reports that this experience translates into concrete process figures: current mass-production line width is approximately 50 microns, the process limit can reach 20 microns, and monthly shipment volume is approximately 200,000 pieces (E9).
The two sources — one focused on the technology's origin date (2004, per Technews) and the other on its current production metrics (50-micron mass production, 20-micron process limit, 200,000 pieces/month, per China Times) — together describe a two-decade-plus technology track record now operating at defined production scale.
According to China Times, Tong Hsing's product structure has continued shifting toward communication and high-power applications: the automotive segment's revenue share fell from 67% to 64%, while the communication segment's share rose to 11% (E10).
This mix shift occurred against a backdrop of overall revenue decline — the same China Times report notes 2025 revenue of NT$11.544 billion, down 4.5% year-on-year (E7) — meaning the communication segment's share gain took place even as total company revenue contracted.
According to China Times, Tong Hsing Electronics (6271) reported 2025 revenue of NT$11.544 billion, down 4.5% year-on-year; gross margin of 27.6%, roughly flat versus the prior year; after-tax net income of NT$1.601 billion, down 6.8% year-on-year; and full-year earnings per share (EPS) of NT$7.64 (E7).
The same report states 2025 capital expenditure was approximately NT$1.4 billion, with 2026 capex projected at a similar scale (E8).
| Financial metric (2025) | Value | YoY change |
|---|---|---|
| Revenue | NT$11.544 billion | -4.5% |
| Gross margin | 27.6% | Flat |
| Net income (after tax) | NT$1.601 billion | -6.8% |
| EPS | NT$7.64 | — |
| Capex (2025) | ~NT$1.4 billion | — |
| Capex (2026, projected) | Similar scale | — |
The evidence points to a company navigating a top-line contraction while continuing to invest in next-generation technology. Per China Times, 2025 revenue fell 4.5% and net income fell 6.8% (E7), yet capital expenditure is being held steady at roughly NT$1.4 billion for both 2025 and 2026 rather than cut (E8). This steady capex sits alongside a documented product-mix shift — automotive share down from 67% to 64%, communication share up to 11% (E10) — and a consistent 400G-to-800G-to-1.6T optical roadmap confirmed across two separately dated reports (E2, E11). At the same time, the company's ceramic core interposer (32×32 channels, 510 x 515 mm² tiling per E3, E4) and AlN substrate (230 W/m⋅K, 150µm thickness per E1, E5) represent specific, customer-verified technical capabilities built on a DPC process foundation dating to 2004 and now running at approximately 200,000 pieces per month (E6, E9). Whether these technology positions translate into a reversal of the 2025 revenue decline is not addressed by the evidence available.
According to Technews, the substrate has reached 230 W/m⋅K in actual customer deployments, supporting laser diodes with power output of 35 to 42 watts per unit (E1).
According to China Times, mass-production line width is approximately 50 microns, the process limit reaches 20 microns, and monthly shipment volume is approximately 200,000 pieces (E9).
According to China Times, 2025 capex was approximately NT$1.4 billion, and 2026 capex is projected at a similar scale (E8).
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