According to a report by CNA (Central News Agency), Taiwan-listed Kingpak Technology (光鼎電子) has launched its ThermaFlat™ SiC MOSFET series, claiming its 650V, 21mΩ device shows only about 8% resistance variation between -25°C and +125°C. Inside.com further reported that the new ThermaFlat™ II series adds a High VGS(th) gate design for improved noise immunity.
What products make up the ThermaFlat™ SiC MOSFET series?
According to CNA, Kingpak Technology (光鼎電子) has introduced the ThermaFlat™ SiC MOSFET series, which the company says is built around what it calls an "Ultra-Low RDS(on) Drift" technology, intended to keep on-resistance stable under high-temperature, high-load conditions (E1).
The series is structured in two generations. CNA reports that the ThermaFlat™ I series is already in stable mass supply in the market, while the company has now formally introduced the all-new ThermaFlat™ II series, which it says gives customers an additional option with better noise immunity and simplified design (E3).
Within the ThermaFlat™ I lineup, CNA reports that Kingpak offers a full range of voltage ratings — 650V and 1200V up to 1700V — packaged in multiple formats including TO-247-3L/4L, TOLL-8L, and Q-DPAK, which the company says allows direct compatibility with mainstream power architectures and shortens customer development cycles (E4).
How does the ThermaFlat™ technology address the high-temperature resistance bottleneck?
CNA cites a concrete measurement: for the 650V, 21mΩ product in a TO-247-3 package, when junction temperature (Tj) rises from -25°C to +125°C, the resistance variation is only about 8% — a figure CNA reports the company describes as "far below" comparable products in the same class (E2).
On the design side, Inside.com reports that the new ThermaFlat™ II series adopts a "High VGS(th)" high gate-threshold-voltage design, which the company says improves system noise immunity and allows the drive circuit to operate stably without a negative turn-off voltage, simplifying design and reducing cost (E8).
Inside.com also reports that the 1200V series within the lineup shows what the company describes as an "extremely low temperature coefficient," which it says can help improve overall power system performance (E9).
What is Kingpak's stated competitive foundation and global footprint?
According to CNA, Hung Min-ching (洪敏清), Vice President of Kingpak's Power Semiconductor Business Unit, said the company's core competitiveness lies in "high quality and consistency," "improving power system performance stability while lowering system cost," and "stable and fast supply capability" (E5).
CNA also reports that Kingpak Technology (stock code: 6226) was founded in 1987 and is described as a globally known LED packaging and electronic components manufacturer (E6). The company maintains global operations and manufacturing bases in Taiwan, China, the United States, India, and Myanmar, which it says supports its aim of providing high-efficiency, high-reliability optoelectronic and power semiconductor solutions to customers worldwide (E7).
What this means
Taken together, the reported figures point to a consistent narrative across the two ThermaFlat™ generations: the 8% resistance variation cited for the 650V/21mΩ device (E2) and the "extremely low temperature coefficient" claimed for the 1200V series (E9) both center on thermal stability across the -25°C to +125°C range, while the ThermaFlat™ II series' High VGS(th) design (E8) addresses a separate but related concern — noise immunity and drive-circuit simplification. This product-level focus on thermal and electrical stability is presented by the company alongside its stated 1987 founding and five-country manufacturing footprint (E6, E7), framing the launch as an extension of an already-established power semiconductor and LED packaging base rather than a new market entry.