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NVIDIA's Spectrum-X Photonic Switch Enters Mass Production, Built With TSMC, SPIL, Foxconn

林紀旭 James LinEditor-in-Chief
Published · Updated
NVIDIA announced its Spectrum-X Ethernet co-packaged-optics (CPO) switch has entered full mass production, calling it the industry's first 200G/lane CPO Ethernet switch system. The hardware is manufactured through a Taiwan-anchored supply chain spanning TSMC, SPIL, Lumentum, TFC and Foxconn.

What does the Spectrum-X mass-production announcement mean for the industry?

NVIDIA has moved its Spectrum-X Ethernet co-packaged-optics switch into full mass production, positioning it as the first 200G/lane CPO Ethernet switch system to reach that stageCITE:E1. The announcement, dated August 15, 2026, marks the transition of the architecture NVIDIA first previewed with named partners back in March 2025 from prototype to shipping productCITE:E1.

What performance advantages does the CPO switch offer over conventional designs?

NVIDIA states the Spectrum-X CPO switch delivers a 5x improvement in network power efficiency, a 5x increase in uninterrupted AI application runtime, and up to a 10x extension of mean time between failures (MTBF)CITE:E2. All three figures are presented by NVIDIA as comparisons against its prior, non-photonic switch designsCITE:E2.

How do the SN6810 and SN6800 differ in specs and use cases?

NVIDIA is shipping two Spectrum-X CPO switch models with different chassis sizes, ASIC counts and port configurationsCITE:E8. The SN6810 fits into a 2U liquid-cooled chassis with 128 ports of 800 Gb/s, for 102.4 Tbps of total capacity, while the SN6800 stacks four ASICs in a 5U system for 409.6 Tbps, supporting 512 ports of 800 Gb/s or over 2,000 ports of 200 Gb/sCITE:E9.

SpecSN6810SN6800
Chassis2U, liquid-cooled5U
ASIC count14
Total switch capacity102.4 Tbps409.6 Tbps
Port configuration128 × 800 Gb/s512 × 800 Gb/s, or 2,000+ × 200 Gb/s

Specifications per NVIDIA's product disclosureCITE:E8CITE:E9.

What roles do TSMC, SPIL, and Foxconn play in the Spectrum-X supply chain?

TSMC (台積電) manufactures the advanced silicon-photonic chips, SPIL (矽品), an ASE Technology (日月光) unit, handles wafer-level and chip-level packaging and test, Lumentum and TFC (天孚通信) supply laser chips and module subassemblies, and Foxconn (鴻海) develops and assembles the complete switch systemCITE:E5. This division of labor was first disclosed earlier: at NVIDIA's GTC event in March 2025, the company named TSMC (2330), Foxconn (2317), ASE Technology's SPIL unit (3711) and 波若威 (3163) as Taiwan partners for the Spectrum-X and Quantum-X CPO switch linesCITE:E11.

How does Spectrum-XGS extend AI networking beyond a single data center?

NVIDIA's Spectrum-XGS technology extends the Spectrum-X network architecture across an entire building or campus, linking multiple data centers into a single coordinated systemCITE:E6. NVIDIA says the technology stays compatible with open-source tools such as SONiC while increasing AI network transmission speed by 1.6xCITE:E6.

How are Taiwan supply-chain firms' AI revenue share and capacity expansion trending?

Three Taiwan supply-chain firms named alongside NVIDIA's Taiwan partner list report rising AI-linked business, though these figures describe their overall AI/HPC exposure rather than Spectrum-X-specific revenue. King Yuan Electronics (京元電) said its 2025 AI-related business is expected to exceed a 20% share of total operations, citing advanced-process demand and AI-driven demand for high-end chips and packaging/testCITE:E12. WinWay Technology (旺矽) said it is expanding capacity to meet customer demand, with second-half capacity able to increase by 30%CITE:E13. Ying Wei (穎崴) said its AI- and HPC-related applications accounted for 52% of its full product-line revenue in 2024, with the company expecting that share to keep growing in 2025CITE:E14.

CompanyMetricValuePeriod
King Yuan Electronics (京元電)AI-related business share>20%2025 (company projection)
WinWay Technology (旺矽)Capacity increase+30%H2 (company projection)
Ying Wei (穎崴)AI/HPC revenue share52%2024

What does this mean?

The roughly 17-month gap between NVIDIA naming TSMC, Foxconn, SPIL and 波若威 as CPO switch partners at GTC in March 2025CITE:E11 and NVIDIA's August 2026 mass-production announcementCITE:E1 spans the same period in which King Yuan Electronics, WinWay Technology and Ying Wei were separately projecting or reporting AI-related revenue shares above 20%, capacity growth of 30%, and AI/HPC shares of 52%CITE:E12CITE:E13CITE:E14. The evidence pack does not attribute those revenue and capacity figures specifically to Spectrum-X volume, so the two threads — NVIDIA's photonic-switch supply chain and Taiwan suppliers' broader AI business growth — are documented in parallel rather than as a direct causal link.

📊 Evidence

FAQ

What makes NVIDIA's new Spectrum-X switch a first for the industry?

NVIDIA describes it as the first 200G/lane co-packaged-optics (CPO) Ethernet switch system to reach mass production<CITE:E1>.

What are the two Spectrum-X switch models NVIDIA has launched?

The SN6810 (2U, 102.4 Tbps, 128×800Gb/s ports) and the SN6800 (5U, 409.6 Tbps, 512×800Gb/s or 2,000+×200Gb/s ports)<CITE:E8><CITE:E9>.

When did NVIDIA first name its Taiwan partners for this CPO switch program?

At NVIDIA's GTC event on March 19, 2025, naming TSMC, Foxconn, ASE Technology's SPIL unit, and 波若威 as partners<CITE:E11>.

📎 Sources

  1. finance.technews.tw
  2. technews.tw
  3. moneydj.com
林紀旭 James LinEditor-in-Chief

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