Speaking on August 6, 2026, Winbond Electronics (華邦電) General Manager Chen Pei-ming said the memory market squeeze will deepen next year, stating directly that "2027 年會比 2026 年還要缺" — 2027 will be tighter than 2026, according to TechNews.
The warning came alongside concrete capacity figures rather than as a standalone forecast. Per a separate CNA report of the same date, Chen said Winbond's Kaohsiung fab currently runs at a monthly capacity of about 15,000 wafers (1.5萬片), with capacity expected to rise to 24,000 wafers (2.4萬片) going forward — the expansion plan Winbond is using to respond to the shortage it is forecasting.
Winbond's Customized Memory Solutions (CMS, low-power DRAM) segment posted a 78% quarter-over-quarter revenue increase, a figure confirmed independently in both source reports. TechNews attributed the gain to price increases, while CNA specified that CMS bit shipments actually declined even as revenue rose.
The two outlets give slightly different shipment figures: TechNews reported CMS bit shipments fell about 10% because Winbond deliberately cut some shipments to prioritize supply to strategic customers, while average selling price (ASP) rose more than 100%. CNA reported a wider range — bit shipments down 11% to 13%, with ASP up about 100%, driving the same ~78% revenue increase.
| Metric | TechNews figure | CNA figure |
|---|---|---|
| CMS bit shipment change (QoQ) | ~-10% | -11% to -13% |
| CMS ASP change (QoQ) | >100% | ~+100% |
| CMS revenue change (QoQ) | +78% | +78% |
Both reports agree on the core dynamic: Winbond chose to constrain CMS shipment volume while letting price do the work, and both converge on the same 78% revenue outcome.
Winbond's Flash division also grew, but the two reports diverge sharply on the shipment-volume figure. TechNews reported Flash revenue up 65% quarter-over-quarter with bit shipments "surging" 156%. CNA, covering the same quarter, reported Flash bit shipments up only about 14% to 16%, with ASP up 41% to 43%, driving what it also described as a 65% revenue increase.
The revenue growth figure (65%) matches across both sources, but the underlying bit-shipment change does not — TechNews's 156% and CNA's 14%-16% are not reconcilable from the evidence available, and neither report clarifies the discrepancy.
On demand drivers, TechNews reported that AI servers are pulling in high-density NOR Flash: a single new-architecture AI server now requires 500 to 600 NOR Flash chips, according to Winbond.
Winbond's Kaohsiung expansion is proceeding in stages. TechNews reported that current capacity stands at 15,000 wafers per month, rising to 24,000 by the end of 2026 — a figure CNA corroborated separately (15,000 to 24,000 wafers, 1.5萬片→2.4萬片).
Beyond that near-term step, TechNews reported a longer-horizon "MB" new fab: construction is scheduled to begin in January 2027, machine installation is set for January 2029, and mass production is targeted for the end of 2029. The new fab's cleanroom will span about 30,000 square meters — twice the size of the existing Kaohsiung fab's 15,500 square meters — and once fully equipped, total capacity across the site could reach 50,000 to 60,000 wafers per month.
| Kaohsiung capacity milestone | Figure | Source |
|---|---|---|
| Current monthly capacity | 15,000 wafers | TechNews / CNA |
| End-2026 target capacity | 24,000 wafers | TechNews / CNA |
| MB new fab construction start | January 2027 | TechNews |
| MB new fab machine installation | January 2029 | TechNews |
| MB new fab mass production | End of 2029 | TechNews |
| MB new fab cleanroom size | ~30,000 sqm (vs. 15,500 sqm existing) | TechNews |
| Total capacity once fully equipped | 50,000-60,000 wafers/month | TechNews |
According to TechNews, Chen set a target for Winbond's Cube-related business — which includes silicon capacitors — to reach 5% to 10% of total company revenue by 2027.
That diversification target sits alongside a sharp increase in capital commitment: CNA reported that Winbond's 2026 capital expenditure will reach NT$39.5 billion (395億元), an increase of more than 70-fold year-on-year, providing the funding base against which new business lines such as Cube would need to scale.
Per CNA, Winbond's consolidated Q2 revenue, including subsidiary Nuvoton (新唐), reached NT$59.843 billion (598.43億元), up 56.4% quarter-over-quarter. Gross margin rose to 66.2%, up 13 percentage points from Q1. Net profit attributable to the parent company hit NT$24.317 billion (243.17億元), up 140.4% quarter-over-quarter, with EPS of NT$5.4 for the quarter and NT$7.65 for the first half of the year.
| Q2 2026 financial metric | Figure |
|---|---|
| Consolidated revenue (incl. Nuvoton) | NT$59.843 billion, +56.4% QoQ |
| Gross margin | 66.2%, +13 percentage points QoQ |
| Net profit attributable to parent | NT$24.317 billion, +140.4% QoQ |
| EPS (Q2) | NT$5.4 |
| EPS (H1 cumulative) | NT$7.65 |
| 2026 capital expenditure | NT$39.5 billion, +70x YoY |
The evidence points to a company funding a multi-year capacity buildout with quarter-one profitability rather than external financing pressure: 2026 capex of NT$39.5 billion, up more than 70-fold year-on-year, lands in the same quarter that net profit rose 140.4% and gross margin climbed to 66.2%. That capex is earmarked for a two-stage Kaohsiung expansion — 15,000 to 24,000 wafers by end-2026, then a second MB fab targeting 50,000-60,000 wafers of total capacity by its end-2029 mass-production date — which stretches years beyond the 2027 shortage window Chen warned about. Within the current quarter, both the CMS and Flash segments show the same pattern of price outrunning volume (CMS ASP +100% against shrinking or flat shipments; Flash ASP +41%-43% against a shipment figure the two source reports do not agree on), consistent with Chen's account of deliberately constrained supply to strategic customers. The Cube business's 5%-10% revenue target by 2027 represents a diversification goal layered on top of, rather than separate from, this capacity and capex expansion.
On August 6, 2026, according to TechNews, Winbond Electronics GM Chen Pei-ming said 2027 would be tighter than 2026 for memory supply.
TechNews reported construction starts January 2027, machine installation begins January 2029, and mass production is targeted for the end of 2029.
According to CNA, net profit attributable to the parent company was NT$24.317 billion, up 140.4% quarter-over-quarter, with quarterly EPS of NT$5.4.
Per TechNews, Winbond aims for Cube-related business, including silicon capacitors, to reach 5% to 10% of total company revenue by 2027.
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