Semiconductor Subsidy Programs by Country (Aug 2026)
US CHIPS, EU Chips Act, Japan/Rapidus, Korea, China Big Fund, Taiwan, India ISM — seven major chip-subsidy programs compared. Key: the headline numbers use wildly different bases (authorized ≠ disbursed ≠ registered capital) — read the basis before comparing.
| Country / region | Program (effective) | Size (mind the basis) | Form | Beneficiary example |
|---|---|---|---|---|
| USA | CHIPS Act (2022) | $52.7B authorized (not disbursed; $39B mfg incentives) | Grants + loans | TSMC Arizona $6.6B, Micron $6.1B, Intel (→govt stake 2025) |
| EU | European Chips Act (2023) | €43B to-be-mobilized (EU budget only ~€3.3B) | Mostly member-state aid | ESMC Dresden (~€5B German aid) |
| Japan | JASM + Rapidus subsidies | JASM ¥1.2tn cap; Rapidus ¥2.354tn cumulative (approved) | Grants + new equity | TSMC Kumamoto, Rapidus (2nm) |
| South Korea | K-Chips Act (2023, raised 2025) | Tax credit (large firms 15%→20%) + KRW150tn loans | Tax credit | Samsung, SK hynix |
| China | Big Fund III (2024) | ¥344B registered capital (not deployed, opaque) | State equity fund | (Fund III targets largely undisclosed) |
| Taiwan | Statute for Industrial Innovation §10-2 (2023–2029) | R&D 25% + equipment 5% credit (no fixed total) | Tax credit | TSMC (main claimant) |
| India | ISM / Semicon India (2021) | ₹76,000 crore (~$10B), up to 50% support | Grants | Micron Sanand, Tata–PSMC Dholera fab |
Method & sources
Amounts/forms/targets from official government pages or authoritative sources, as of Aug 2026. **Caliber rule (the big risk here)**: US $52.7B, EU €43B, India ₹76,000 crore are "authorized / to-be-mobilized" totals, not disbursed (US actual disbursement is far below authorization; EU's €43B is a public-private leverage figure — direct EU-budget input is only ~€3.3B, the rest is member-state aid); China Big Fund III's ¥344B is "registered capital (subscribed)", not deployed, and deployment is opaque; Japan's ¥2.354tn (Rapidus cumulative) and ¥1.2tn (JASM cap) are "committed/approved"; Taiwan and Korea are tax credits with no fixed total (the amount column states rates/thresholds instead). USD conversions are approximate. **Recent changes**: US converted Intel's grant to a ~9.9% government stake (Aug 2025); EU's Intel Magdeburg project is shelved (not listed as a current beneficiary); Korea uses the 2025-raised 20%/30% rates. **Notes**: Korea's 2026 "IRA-style" production credit eligibility is undecided; China Big Fund III actual outlays and beneficiaries are opaque (uncertain). Sources: EU Commission https://digital-strategy.ec.europa.eu/en/policies/european-chips-act ; Rapidus https://www.rapidus.inc/en/news_topics/information/rapidus-secures-267-6-billion-yen-in-funding-from-japan-government-and-private-sector-companies/ ; India ISM https://ism.gov.in/ ; Intel stake https://www.intc.com/news-events/press-releases/detail/1748/ .
Source: https://digital-strategy.ec.europa.eu/en/policies/european-chips-act
Retrieved: 2026-08-26
FAQ
- What does "Semiconductor Subsidy Programs by Country (Aug 2026)" cover?
- It covers USA, EU, Japan, South Korea, China, Taiwan, India, compared across: Country / region, Program (effective), Size (mind the basis), Form, Beneficiary example.
- What are the sources and methodology?
- Amounts/forms/targets from official government pages or authoritative sources, as of Aug 2026.
- When was this data last updated?
- The data was retrieved/updated on 2026-08-26.