According to CNA, the transmitter developed by Foxconn Research Institute (HHRI) and NYCU combines three technologies: an ultra-wideband quantum dot comb laser, PAM4 signal modulation, and multi-core optical fiber (E3). UDN's report describes the comb laser as using a single specialized laser source that functions like "a magic comb" capable of stably splitting light into 23 distinct wavelength channels (E6). The PAM4 modulation stacks data onto each of those channels, while the multi-core fiber packs multiple data paths into a single strand of fiber, according to UDN (E7, E8).
CNA reported that the technology allows chip-to-chip communication at a speed of 34 Tbit/s, which the outlet says is intended to boost AI computing power (E2). UDN broke this figure down further: each of the 23 wavelength channels carries 212 Gbit of data per second under PAM4 modulation (E7). By embedding seven cores into a single optical fiber, the team achieved a combined transmission speed of 34.132 Tbit/s, according to UDN (E8).
| Metric | Value | Source |
|---|---|---|
| Chip-to-chip interconnect speed | 34 Tbit/s | CNA (E2) |
| Wavelength channels per laser | 23 | UDN (E6) |
| Data rate per channel (PAM4) | 212 Gbit/s | UDN (E7) |
| Combined fiber transmission speed | 34.132 Tbit/s | UDN (E8) |
UDN reported that the design uses a high-frequency GSSG (ground-signal-signal-ground) electrode configuration, described in the report as a "protective shield" that lets sensitive components inside the chip "wear bulletproof vests" to block electromagnetic interference from neighboring circuits, keeping signals clear during high-frequency operation (E4). The same report states that because the design uses a single light source, chip heat generation can be substantially reduced, which UDN says allows data centers to become more power-efficient, achieving what the report calls an "energy-saving" effect (E4).
Both CNA and UDN reported that Foxconn Research Institute, together with NYCU, successfully developed the "high-capacity silicon photonics transmitter" and that the results were published in Optics Express, described by both outlets as an authoritative academic journal in global optics (E1, E5). According to UDN, the breakthrough was completed by HHRI Semiconductor Institute Director Hao-Chung Kuo, team leader Yu-Heng Hong, and researcher Yun-Han Chang, working alongside NYCU Distinguished Professor Chih-Wei Tsou. UDN also reported that the research received support from the National Science and Technology Council (NSTC), the Industrial Technology Research Institute (ITRI), and a research team led by National Chung Hsing University Chair Professor Mu-Hai Cheng (E9).
Taken together, the figures reported by CNA and UDN show a consistent chain of engineering choices feeding into a single performance outcome: 23 wavelength channels from the quantum dot comb laser (E6), each carrying 212 Gbit/s via PAM4 modulation (E7), combine through a seven-core fiber to produce the 34.132 Tbit/s figure UDN cites (E8) — closely matching the 34 Tbit/s chip-interconnect speed CNA reported separately (E2). The GSSG electrode design UDN describes as blocking electromagnetic interference and reducing heat via a single light source (E4) is presented as a complement to that speed gain, addressing signal integrity and power consumption rather than throughput itself. Both outlets attribute the underlying research to the same named team and the same Optics Express publication (E1, E5, E9), indicating the CNA and UDN accounts describe the same underlying study from two separate newsroom write-ups.
According to both CNA and UDN, the findings were published in Optics Express, described by both outlets as an authoritative academic journal in the global optics field.
Per UDN, the work was completed by Foxconn Research Institute's Semiconductor Institute Director Hao-Chung Kuo, team leader Yu-Heng Hong, and researcher Yun-Han Chang, alongside NYCU Distinguished Professor Chih-Wei Tsou, with support from the NSTC, ITRI, and a research team led by National Chung Hsing University Chair Professor Mu-Hai Cheng.
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